The TS3335D-1 series multifunctional laser trimming machine is suitable for tuning of various thin-film circuits, such as inertial gyroscopes, high-precision resistors, analog ICs, and precision laser trimming of thin-film sensors. The TS3335D-1 series wafer-level laser trimming machine is suitable for trimming of semiconductor wafers and various high-precision MEMS devices.
TS3335D Series | Thin Film Laser Trimming Machine
The TS3335D-1 series multifunctional laser trimming machine is suitable for tuning of various thin-film circuits, such as inertial gyroscopes, high-precision resistors, analog ICs, and precision laser trimming of thin-film sensors. The TS3335D-1 series wafer-level laser trimming machine is suitable for trimming of semiconductor wafers and various high-precision MEMS devices.
Details
TS3335D
Specifications
| Model | TS3335D -Ⅰ | TS3335D – Ⅱ |
| Wavelength | 355nm | 356nm |
| Laser Power | ＞2W | ＞1W |
| Beam Size | 10-15μm | 4-5μm |
| Scanning Speed | 0-6000mm/s Adjustable | 0-6000mm/s Adjustable |
| XY Stage Travel | 200*300mm | 200*300mm |
| XY Stage Precision | ±1μm | ±1μm |
